From Transistors to Bumps: Preparing SEM Cross-Sections by Combining Site-specific Cleaving and Broad Ion Beam Milling

Published in SOLID STATE TECHNOLOGY (www.solid-state.com) in December 2014.

Cross section sample preparation is demonstrated using a workflow that combines High Accuracy Cleaving (HAC) (http://www.latticegear.com) and Broad Ion Beam (BIB) milling (Hitachi IM4000).