Plasma Etch Platform | 600-Series

600-Series Plasma Etch Platform
600-Series Plasma Etch Platform

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Overview

Hitachi's 600-Series Dry Plasma Etcher

  • Microwave ECR/EMCP Chamber Options
  • High-Volume Production Capability
  • 2 Etch Chambers
  • 2 Ash Chambers
  • Factory Integration
  • 125mm – 200mm Wafer Size
  • Open Cassette Interface
  • Fully Flexible Chamber Flow Programming
  • Dedicated Load/Unload Ports

Hitachi’s 600-Series platform is Hitachi’s multi-chamber platform based on the 500-Series etch system. The platform incorporates two etch chambers and two optional ash chambers. Similar to the 500-Series, the 600-Series provides a three-wafer cassette interface with separate load and unload locks.

The platform delivers high-volume production that leverages the 500-Series’ superior etch capability. The 600-Series platform can be configured with either the Microwave ECR etch chamber or the non-volatile EMCP etch chamber.